Quantum Systems
Early 2019 I joined IBM full time in Rochester, MN. I work on the embedded firmware for IBM's Quantum Systems. My favorite part of this job is all the unique technical challenges it offers. The fast pace environment bringing up new technology has been a excellent fit and I find it very exciting to be a part of.
Early 2019 I joined IBM full time in Rochester, MN. I work on the embedded firmware for IBM's Quantum Systems. My favorite part of this job is all the unique technical challenges it offers. The fast pace environment bringing up new technology has been a excellent fit and I find it very exciting to be a part of.
Digital Design Engineering Internship
Summer 2018 I interned with TI in Dallas, TX. This experience gave me exposure to mixed-signal design flow and a technical understanding of power devices at multiple levels (transistor level, block system level). My main assignment was to create a unified verification tool for testing across a family of embedded processor devices. In the end, I delivered an easy to use GUI application that would automatically set up and handle the organization of necessary simulation dependencies to abstract the user from underlying complexities. This project allowed me to work with industry System Verilog and C test files. It also taught me much about the verification process in the form of test benches for simulation and debug.
Summer 2018 I interned with TI in Dallas, TX. This experience gave me exposure to mixed-signal design flow and a technical understanding of power devices at multiple levels (transistor level, block system level). My main assignment was to create a unified verification tool for testing across a family of embedded processor devices. In the end, I delivered an easy to use GUI application that would automatically set up and handle the organization of necessary simulation dependencies to abstract the user from underlying complexities. This project allowed me to work with industry System Verilog and C test files. It also taught me much about the verification process in the form of test benches for simulation and debug.
Non-volatile Product Engineering Internship
Summer 2017 I was fortunate to intern with Micron in Boise, ID. My role was to design and run test scripts on NAND memory units for verification and stress experimentation. I was also in charge of creating automated JMP scripts to preform statistical analysis on bench results. I developed the skills to run experiments independently and present findings effectively in meetings. A tool I created during this internship located where Vt distributions diverged and was useful for easily identifying run to run variations. I also wrote and distributed many automation scripts to standardize the process for test comparison across the department. This internship gave me exposure to the silicon process of memory, die assembly, wafer probing, packaged die testers, Perl, and JMP scripts.
Summer 2017 I was fortunate to intern with Micron in Boise, ID. My role was to design and run test scripts on NAND memory units for verification and stress experimentation. I was also in charge of creating automated JMP scripts to preform statistical analysis on bench results. I developed the skills to run experiments independently and present findings effectively in meetings. A tool I created during this internship located where Vt distributions diverged and was useful for easily identifying run to run variations. I also wrote and distributed many automation scripts to standardize the process for test comparison across the department. This internship gave me exposure to the silicon process of memory, die assembly, wafer probing, packaged die testers, Perl, and JMP scripts.
Power Subsystem Qualification Engineering Internship
Summer 2016 I had the opportunity to do an internship with IBM in Rochester, MN. For this job I worked directly with suppliers on early product development, qualification and failure analysis. I learned how to effectively communicate with my peers to work as a team. I have also learned how to independently step up to get a project moving. During this internship I contributed by creating a testing rig to increase throughput of identifying VRM failures by 4x. I also wrote an automation script to upload query data which eliminated months of backlog. This internship gave me a hands on experience making me very familiar with a variety of electrical equipment: oscilloscopes, spectrum analyzers, power supplies and voltage regulators.
Summer 2016 I had the opportunity to do an internship with IBM in Rochester, MN. For this job I worked directly with suppliers on early product development, qualification and failure analysis. I learned how to effectively communicate with my peers to work as a team. I have also learned how to independently step up to get a project moving. During this internship I contributed by creating a testing rig to increase throughput of identifying VRM failures by 4x. I also wrote an automation script to upload query data which eliminated months of backlog. This internship gave me a hands on experience making me very familiar with a variety of electrical equipment: oscilloscopes, spectrum analyzers, power supplies and voltage regulators.
Graduate Teachers Assistant
Fall of 2017-2018 I worked as a graduate teachers assistant for Dr. Joseph Zambreno. The course I helped teach was Senior Design and was comprised of 250+ Electrical, Computer and Software Engineers. My responsibilities were to fairly grade groups on their performance and identify shortcomings early that may prevent project completion. I also held office hours for answering individual questions and provide help with the class.
Fall of 2017-2018 I worked as a graduate teachers assistant for Dr. Joseph Zambreno. The course I helped teach was Senior Design and was comprised of 250+ Electrical, Computer and Software Engineers. My responsibilities were to fairly grade groups on their performance and identify shortcomings early that may prevent project completion. I also held office hours for answering individual questions and provide help with the class.